- Manufacturer：
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- CUI Devices (3)
- iBASE Technology (1)
- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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8 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY... |
1-3 days |
194
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY... |
1-3 days |
51
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY... |
1-3 days |
43
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | FANSINK ASSEMBLY... |
1-3 days |
5,787
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
5,883
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
8,778
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
8,915
In-stock
|
View details Get Quote | ||
|
|
iBASE Technology | HEATSINK;HSIBR117... |
1-3 days |
7,830
In-stock
|
View details Get Quote |
