- Manufacturer：
-
- BOYD (2)
- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
-
- Type：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK TO-263 19.3... |
1-3 days |
11,278
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-263 (D2... |
1-3 days |
8,498
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-263 CO... |
1-3 days |
300
In-stock
|
View details Get Quote | ||
|
|
BOYD | TOP MOUNT HEATSI... |
1-3 days |
6,407
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 19... |
1-3 days |
5,895
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK SMT PKG |
1-3 days |
8,849
In-stock
|
View details Get Quote |
