- Manufacturer：
-
- BOYD (2)
- Comair Rotron (1)
- CUI Devices (1)
- Product Status：
-
- Material：
-
- Attachment Method：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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5 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-252 D-P... |
1-3 days |
5,388
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK SMT D-PA... |
1-3 days |
33,242
In-stock
|
View details Get Quote | ||
|
|
BOYD | TOP MOUNT HEATSI... |
1-3 days |
6,452
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK TO-252 CO... |
1-3 days |
5,886
In-stock
|
View details Get Quote | ||
|
|
Comair Rotron | HEATSINK STAMP 22... |
1-3 days |
5,016
In-stock
|
View details Get Quote |
