- Manufacturer：
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- BOYD (1)
- CUI Devices (3)
- DFRobot (2)
- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Material Finish：
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8 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK TO-126 VE... |
1-3 days |
9,438
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK TO-126 13.2... |
1-3 days |
1,027
In-stock
|
View details Get Quote | ||
|
|
DFRobot | RASPBERRY PI COP... |
1-3 days |
293
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1-3 days |
120
In-stock
|
View details Get Quote | ||
|
|
DFRobot | PURE COPPER HEAT... |
1-3 days |
55
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.7W... |
1-3 days |
6,205
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-126 BL... |
1-3 days |
91
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1-3 days |
7
In-stock
|
View details Get Quote |
