- Manufacturer：
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- CUI Devices (2)
- Type：
-
- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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9 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1-3 days |
1,760
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1-3 days |
946
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
3,610
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK CPU FOR... |
1-3 days |
414
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
2,387
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1-3 days |
2,308
In-stock
|
View details Get Quote | ||
|
|
TE Connectivity AMP Connectors | QSFP DOUBLE SAN H... |
1-3 days |
9,518
In-stock
|
View details Get Quote | ||
|
|
TE Connectivity AMP Connectors | QSFP SINGLE SAN E... |
1-3 days |
7,909
In-stock
|
View details Get Quote | ||
|
|
TE Connectivity AMP Connectors | GANGED QSFP SAN E... |
1-3 days |
7,156
In-stock
|
View details Get Quote |
