- Manufacturer:
-
- BOYD (8)
- Length:
-
- Shape:
-
- Width:
-
- Diameter:
-
- Attachment Method:
-
- Package Cooled:
-
- Fin Height:
-
- Power Dissipation @ Temperature Rise:
-
- Thermal Resistance @ Natural:
-
- Material Finish:
-
12 Records
Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Wakefield Thermal | HEATSINK POWER T... |
1-3 days |
245
In-stock
|
View details Get Quote | ||
![]() |
BOYD | 78220 EXTRUSION 2.36X... |
1-3 days |
8,366
In-stock
|
View details Get Quote | ||
![]() |
BOYD | BOARD LEVEL HEAT... |
1-3 days |
12,383
In-stock
|
View details Get Quote | ||
![]() |
BOYD | HEAT SINK 1.75" HIG... |
1-3 days |
407
In-stock
|
View details Get Quote | ||
![]() |
BOYD | HEATSINK 1.75" HI R... |
1-3 days |
4,150
In-stock
|
View details Get Quote | ||
![]() |
BOYD | HEATSINK TO-3 0.5"17... |
1-3 days |
5,226
In-stock
|
View details Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK TO-220 OM... |
1-3 days |
9,179
In-stock
|
View details Get Quote | ||
![]() |
TE Connectivity AMP Connectors | HEAT SINK BGA 29MM... |
1-3 days |
7,653
In-stock
|
View details Get Quote | ||
![]() |
Wakefield Thermal | HEATSINK TO-220 OM... |
1-3 days |
6,289
In-stock
|
View details Get Quote | ||
![]() |
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,606
In-stock
|
View details Get Quote | ||
![]() |
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,568
In-stock
|
View details Get Quote | ||
![]() |
BOYD | BOARD LEVEL HEAT... |
1-3 days |
5,635
In-stock
|
View details Get Quote |