- Manufacturer：
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- BOYD (1)
- Product Status：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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8 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
595
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
10,521
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 TA... |
1-3 days |
6,048
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
868
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
5,455
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
7,112
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
7,862
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 28MM... |
1-3 days |
5,279
In-stock
|
View details Get Quote |
