- Manufacturer：
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- BOYD (2)
- Product Status：
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- Type：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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9 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | HEATSINK CPU 21MM... |
1-3 days |
13,498
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-5 1.25W... |
1-3 days |
1,404
In-stock
|
View details Get Quote | ||
|
|
Advanced Thermal Solutions, Inc. | HEATSINK TO-126 BL... |
1-3 days |
91
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 21MM... |
1-3 days |
9,806
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 21MM... |
1-3 days |
9,484
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 21MM... |
1-3 days |
6,962
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK FOR 21MM... |
1-3 days |
9,879
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,614
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | HEATSINK CPU 21MM... |
1-3 days |
5,387
In-stock
|
View details Get Quote |
