- Manufacturer:
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- CUI Devices (1)
- Material:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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- Material Finish:
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9 Records
Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
1-3 days |
7,338
In-stock
|
View details Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1-3 days |
160
In-stock
|
View details Get Quote | ||
![]() |
CUI Devices | HEAT SINK, STAMPI... |
1-3 days |
2,986
In-stock
|
View details Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | SUPERGRIP HEATSI... |
1-3 days |
281
In-stock
|
View details Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 23MM X 23... |
1-3 days |
1,533
In-stock
|
View details Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK TO-220 CO... |
1-3 days |
1,253
In-stock
|
View details Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | HEAT SINK 25MM X 25... |
1-3 days |
928
In-stock
|
View details Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK 23X23X14.5M... |
1-3 days |
5,512
In-stock
|
View details Get Quote | ||
![]() |
Advanced Thermal Solutions, Inc. | HEATSINK 25X25X14.5M... |
1-3 days |
8,665
In-stock
|
View details Get Quote |