- Manufacturer：
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- BOYD (1)
- CUI Devices (1)
- Material：
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- Attachment Method：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Natural：
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2 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
485
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEAT SINK, BGA, 21 ... |
1-3 days |
7,424
In-stock
|
View details Get Quote |
