- Manufacturer:
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- Cooling Source (1)
- CUI Devices (1)
- Type:
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- Attachment Method:
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- Package Cooled:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Natural:
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2 Records
Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | HEATSINK TO-220 4.1W... |
1-3 days |
8,016
In-stock
|
View details Get Quote | ||
![]() |
Cooling Source | 30X30X10MM |
1-3 days |
32
In-stock
|
View details Get Quote |