Manufacturer:
Attachment Method:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Factory Lead Time Stock Action
HSS-B20-NP-01 CUI Devices
HEATSINK TO-220 4.1W...
1-3 days
RFQ
8,016
In-stock
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CS8673010B0 Cooling Source
30X30X10MM
1-3 days
RFQ
32
In-stock
View details Get Quote
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