- Manufacturer：
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- BOYD (6)
- Length：
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- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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7 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
1,766
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
1,684
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 TI... |
1-3 days |
6,000
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK TO-220 LI... |
1-3 days |
4,312
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
3,265
In-stock
|
View details Get Quote | ||
|
|
NTE Electronics, Inc. | HEAT SINK PLAST.P... |
1-3 days |
166
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,330
In-stock
|
View details Get Quote |
