- Manufacturer:
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- BOYD (4)
- CTS Corporation (1)
- Product Status:
-
- Length:
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- Type:
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- Material:
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- Width:
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- Diameter:
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- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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8 Records
Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
3,897
In-stock
|
View details Get Quote | ||
![]() |
BOYD | HEATSINK BGA 23X23... |
1-3 days |
1,132
In-stock
|
View details Get Quote | ||
![]() |
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
3,610
In-stock
|
View details Get Quote | ||
![]() |
BOYD | BOARD LEVEL HEAT... |
1-3 days |
34
In-stock
|
View details Get Quote | ||
![]() |
NTE Electronics, Inc. | HEAT SINK-TO-5 TRA... |
1-3 days |
16
In-stock
|
View details Get Quote | ||
![]() |
BOYD | BOARD LEVEL HEAT... |
1-3 days |
5,125
In-stock
|
View details Get Quote | ||
![]() |
BOYD | BOARD LEVEL HEAT... |
1-3 days |
9,536
In-stock
|
View details Get Quote | ||
![]() |
CTS Corporation | HEATSINK CAP .500"H... |
1-3 days |
5,278
In-stock
|
View details Get Quote |