- Manufacturer：
-
- BOYD (1)
- CTS Corporation (1)
- CUI Devices (1)
- Ohmite (3)
- Product Status：
-
- Length：
-
- Material：
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- Width：
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- Attachment Method：
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- Package Cooled：
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- Fin Height：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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6 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Ohmite | ALUMINUM HEATSIN... |
1-3 days |
158
In-stock
|
View details Get Quote | ||
|
|
CTS Corporation | HEATSINK PWR DUA... |
1-3 days |
1,152
In-stock
|
View details Get Quote | ||
|
|
Ohmite | HEATSINK TO-218,TO... |
1-3 days |
4,523
In-stock
|
View details Get Quote | ||
|
|
Ohmite | ALUMINUM HEATSIN... |
1-3 days |
7,437
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
8,665
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK HALF BR... |
1-3 days |
9,482
In-stock
|
View details Get Quote |
