- Manufacturer：
-
- BOYD (2)
- CTS Corporation (1)
- Type：
-
- Material：
-
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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3 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEAT SINK TO-3 1.25"... |
1-3 days |
2,962
In-stock
|
View details Get Quote | ||
|
|
CTS Corporation | HEATSINK FORGED ... |
1-3 days |
7,600
In-stock
|
View details Get Quote | ||
|
|
BOYD | BOARD LEVEL HEAT... |
1-3 days |
6,028
In-stock
|
View details Get Quote |
