- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
2 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
BOYD | HEATSINK BGA W/AD... |
1-3 days |
6,309
In-stock
|
View details Get Quote | ||
|
|
BOYD | BGA HEAT SINK |
1-3 days |
3,721
In-stock
|
View details Get Quote |
