Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Factory Lead Time Stock Action
V2016B ASSMANN WSW Components
HEATSINK CPU XCU...
1-3 days
RFQ
48,823
In-stock
View details Get Quote
HSB01-080808 CUI Devices
HEAT SINK, BGA, 8.5...
1-3 days
RFQ
2,325
In-stock
View details Get Quote
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