- Manufacturer：
-
- Adafruit (1)
- CUI Devices (1)
- Type：
-
- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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5 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Adafruit | MINI ALUMINUM HE... |
1-3 days |
1,172
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.9W... |
1-3 days |
2,970
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1-3 days |
351
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1-3 days |
335
In-stock
|
View details Get Quote | ||
|
|
T-Global Technology | ALUMINIUM HEAT S... |
1-3 days |
6,154
In-stock
|
View details Get Quote |
