- Manufacturer：
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- BOYD (3)
- CUI Devices (1)
- Length：
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- Material：
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- Attachment Method：
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- Package Cooled：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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7 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
36,006
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
3,897
In-stock
|
View details Get Quote | ||
|
|
ASSMANN WSW Components | HEATSINK ALUM AN... |
1-3 days |
2,786
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEATSINK 14-DIP/16-... |
1-3 days |
1,978
In-stock
|
View details Get Quote | ||
|
|
BOYD | 61565 EXTRUSION 0.19X... |
1-3 days |
1
In-stock
|
View details Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.6W... |
1-3 days |
7
In-stock
|
View details Get Quote | ||
|
|
BOYD | HEAT SINK |
1-3 days |
7,965
In-stock
|
View details Get Quote |
