- Manufacturer:
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- Cooling Source (2)
- CUI Devices (1)
- Material:
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- Attachment Method:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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3 Records
Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
CUI Devices | HEAT SINK, BGA, 28.... |
1-3 days |
1,672
In-stock
|
View details Get Quote | ||
![]() |
Cooling Source | 28.5X28.5X10MM |
1-3 days |
950
In-stock
|
View details Get Quote | ||
![]() |
Cooling Source | 28.5X28.5X10MM |
1-3 days |
13
In-stock
|
View details Get Quote |