Manufacturer:
Package Cooled:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Thermal Resistance @ Natural:
Image Part Manufacturer Description Factory Lead Time Stock Action
HSB25-282810 CUI Devices
HEAT SINK, BGA, 28....
1-3 days
RFQ
1,672
In-stock
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CS8672810B0 Cooling Source
28.5X28.5X10MM
1-3 days
RFQ
950
In-stock
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CS8672810B1 Cooling Source
28.5X28.5X10MM
1-3 days
RFQ
13
In-stock
View details Get Quote
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