- Manufacturer:
-
- BOYD (6)
- Chip Quik, Inc. (3)
- Size / Dimension:
-
- Storage/Refrigeration Temperature:
-
- Usable Temperature Range:
-
- Thermal Conductivity:
-
9 Records
Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
---|---|---|---|---|---|---|---|
![]() |
BOYD | THERMAL PASTE |
1-3 days |
8,982
In-stock
|
View details Get Quote | ||
![]() |
BOYD | THERMAL PASTE |
1-3 days |
9,061
In-stock
|
View details Get Quote | ||
![]() |
Chip Quik, Inc. | HEAT SINK COMPOU... |
1-3 days |
6
In-stock
|
View details Get Quote | ||
![]() |
Chip Quik, Inc. | HEAT SINK COMPOU... |
1-3 days |
6
In-stock
|
View details Get Quote | ||
![]() |
Chip Quik, Inc. | HEAT SINK COMPOU... |
1-3 days |
20
In-stock
|
View details Get Quote | ||
![]() |
BOYD | THER-O-LINK PASTE... |
1-3 days |
9,361
In-stock
|
View details Get Quote | ||
![]() |
BOYD | THERMAL PASTE |
1-3 days |
8,166
In-stock
|
View details Get Quote | ||
![]() |
BOYD | THERMAL PASTE |
1-3 days |
7,873
In-stock
|
View details Get Quote | ||
![]() |
BOYD | THERMAL PASTE |
1-3 days |
5,091
In-stock
|
View details Get Quote |