- Manufacturer：
-
- BOYD (3)
- MG Chemicals (1)
- Techspray (2)
- Size / Dimension：
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- Storage/Refrigeration Temperature：
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- Usable Temperature Range：
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- Thermal Conductivity：
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11 Records
| Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Wakefield Thermal | NONSILICONE GREA... |
1-3 days |
7,522
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | THERMAL COMPOUND... |
1-3 days |
321
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | NONSILICONE GREA... |
1-3 days |
224
In-stock
|
View details Get Quote | ||
|
|
BOYD | THERMAL PASTE |
1-3 days |
191
In-stock
|
View details Get Quote | ||
|
|
Wakefield Thermal | NONSILICONE GREA... |
1-3 days |
493
In-stock
|
View details Get Quote | ||
|
|
Techspray | SILICONE FREE HE... |
1-3 days |
55
In-stock
|
View details Get Quote | ||
|
|
Techspray | SILICONE FREE HE... |
1-3 days |
29
In-stock
|
View details Get Quote | ||
|
|
MG Chemicals | EPOXY MOLD RELEA... |
1-3 days |
22
In-stock
|
View details Get Quote | ||
|
|
NTE Electronics, Inc. | 1 OZ HEAT SINK COM... |
1-3 days |
327
In-stock
|
View details Get Quote | ||
|
|
BOYD | THERMAL PASTE |
1-3 days |
9,450
In-stock
|
View details Get Quote | ||
|
|
BOYD | THERMAL PASTE |
1-3 days |
7,221
In-stock
|
View details Get Quote |
