- Manufacturer:
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- CTS Corporation (1)
- CUI Devices (1)
- Attachment Method:
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- Package Cooled:
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- Fin Height:
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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2 Records
Image | Part | Manufacturer | Description | Factory Lead Time | Stock | Action | |
---|---|---|---|---|---|---|---|
CUI Devices | HEAT SINK, BGA, 25 ... |
1-3 days |
96
In-stock
|
View details Get Quote | |||
CTS Corporation | HEATSINK FORGED ... |
1-3 days |
6,913
In-stock
|
View details Get Quote |